Glass Drilling

​​              CNC glass drilling utilizes advanced computer-controlled machinery equipped with diamond-tipped drill bits to perform high-precision hole drilling in glass substrates. This mechanical method is ideal for creating a wide variety of functional holes in cover glass panels, including through holes, blind holes, and countersunk holes, with exceptional accuracy and repeatability.

Key Characteristics:

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• Suitable for larger hole diameters, typically from a few millimeters up to several centimeters

• Supports multiple hole types: through holes, blind holes, countersinks

• Compatible with glass thicknesses from 0.5 mm to 5 mm or more

• Requires post-drilling edge polishing to remove micro-cracks and enhance durability

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Advantages:

• High dimensional precision (tolerance up to ±0.05 mm) for tight-fitting components

• Cost-effective for batch processing and medium-to-high volume production

• Suitable for flat glass, chemical-strengthened glass, and optical-grade materials

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CNC glass drilling is the go-to solution for manufacturers requiring clean, repeatable, and scalable hole creation in displays, sensor modules, device enclosures, and industrial control panels.

​              Laser glass drilling uses a focused high-energy laser beam to remove material from the glass surface through thermal ablation or photochemical interaction, enabling the creation of micro-sized holes with extreme precision. As a non-contact process, it minimizes mechanical stress and damage, making it ideal for thin and sensitive glass types, including chemically strengthened glass.

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Key Characteristics:

• Designed for micro-hole drilling, typically ranging from tens to hundreds of microns

• Contact-free process eliminates stress cracks and surface chipping

• Produces cleaner edge quality, often with minimal or no post-processing

• Compatible with thin glass substrates and optical components

Advantages:

• Exceptional accuracy, suitable for fine-featured sensor openings, microfluidic channels, and precision optics

• Performs well on chemically strengthened, ultra-thin, or coated glass

• Enables complex pattern creation and tight hole spacing

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Laser drilling is widely used in advanced electronics, medical devices, displays, and optical systems where precision, clarity, and minimal thermal distortion are essential.

              Ultrasonic glass drilling utilizes high-frequency mechanical vibrations combined with abrasive slurry to gently and precisely remove material from the glass surface. This method is particularly effective for drilling high-aspect-ratio holes and complex geometries in brittle or hard-to-machine glass types, without generating significant heat or mechanical stress.

Key Characteristics: 

• Suitable for small to medium-sized holes (typically 0.3 mm to several mm)

• Produces smooth, chip-free edges with excellent hole circularity

• Low thermal input prevents micro-cracking or deformation

• Can be applied to flat, curved, or chemically strengthened glass

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Advantages:

• Ideal for specialty glasses, including borosilicate, aluminosilicate, and quartz glass

• Precision drilling of blind holes, deep holes, and non-standard shapes

• Excellent for applications requiring clean finishes and material integrity

• Compatible with delicate substrates that may be unsuitable for conventional mechanical or laser drilling

Ultrasonic drilling is widely used in optical devices, medical diagnostics, advanced sensors, and micro-structured glass components, where dimensional accuracy and low damage are critical.